Sito Telprom

High Technology RF and Microwave Printed Circuit Boards: double sided, multilayer, flexible and metal backed. DLVA, SDLVA Amplifiers, BGA Modules, complete with components, Switches, Sub-systems

Double sided RF soft boards
HDI – ultra fine line multilayer circuits
Metal backed RF boards
Mixed dielectric RF boards
Multilayer RF boards (PTFE)
PCB with 75 µ laser drilled micro-vias
Wire bonding of MMIC’s on RF boards and MCM’s

Amplifier modules - broad band
Amplifier modules - multi octave
Assembly and test of microwave components and modules
BGA - Ball Grid Array modules
DLVA (Detector Logaritmic Video Amplifiers)
Switches (pin diode multi-octave)